Additive manufacturing of Cu/Ni by selective electrochemical deposition on local conductive substrate

Electrodeposition is a novel and benign fabrication method which excellently combines electrochemical deposition mechanism additive manufacturing to realize the processing of metal-based structures layer-upon-layer. Herein, an unusual (AM) proposed based on deposition. Notably, three-dimensional forming metal by local conductive samples (PLA-CNTs7wt%) as cathode through selective was realized. Moreover, effect time surface morphology quality sample were explored. Besides, preparing parts in array type solves problem slow (ECAM) provides new approach achieve mass production for industry. Then, prepared copper-nickel multilayer realized ECAM multi-metals. Finally, 4D printing bimetallic preliminarily explored, feasibility energy storage elements further proved.